窄板;
With the rapid development of integrated circuits, the traditional conductive pastes in which the sizes of the functional phase are in the range of micros can not meet the demands for low-temperature sintering, narrow line widths and multi-layer boards.
随着集成电路的高速发展,传统的微米级导电浆料已不能满足低温烧结和多层布线的要求。
纳米英语 · 双语娱乐资讯
纳米英语 · 商务口语
纳米英语 · 高考英语